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Sonic Lift-Off Tech Aims to Reduce Semiconductor Costs

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The patented process, called Sonic Lift-Off, uses sound waves to cut single crystal wafers used in semiconductor-based device fabrication.

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Semiconductor device manufacturing requires the availability of high-quality wafers with perfectly flat and smooth surfaces. The quality of a wafer's surface is fundamental to ensuring high-performing and reliable devices. It is necessary to prevent the formation of impurities or surface irregularities that could introduce defects in the final component and lead to increased costs.

An innovative device lift-off and substrate reuse technology based on the power of sound, under development at Crystal Sonic, Inc., aims to lower per-device manufacturing costs substantially.

Today, nearly 50% of wide bandgap (WBG) device manufacturing costs are attributed to the substrate material. At the same time, WBG substrate wafer demand is ramping up, mainly driven by applications including automotive, solar inverters, motor, and wind inverters, particularly for silicon carbide (SiC).


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