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U.S. Focuses on Invigorating 'Chiplets' to Stay Cutting-Edge in Tech

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At Promex Industries in Silicon Valley, chips and packaging materials are joined together.

Chiplets rapidly gained traction because smaller chips are cheaper to make, while bundles of them can top the performance of any single slice of silicon.

Credit: Jim Wilson/The New York Times

To stay at the forefront of semiconductor technology, the U.S. has turned its attention to "chiplets," multiple smaller chips packaged tightly together to work like a single electronic brain.

Data from trade association IPC indicates the U.S. accounts for 12% of global semiconductor production and just 3% of chip packaging.

Last year's CHIPS Act dedicated $52 billion in subsidies to bolster domestic chip manufacturing and help advanced packaging factories in the U.S. boost their market share.

The U.S. Department of Commerce is accepting applications for manufacturing grants, including for chip packaging factories, and has earmarked funding for an advanced packaging research program.

Meanwhile, $50 million in funding was announced in March as part of the Defense Production Act for U.S. and Canadian companies involved in advanced packaging and domestic circuit board production.

From The New York Times
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