acm-header
Sign In

Communications of the ACM

ACM TechNews

A New Front Is Opening in the U.S.-China Chip Conflict


View as: Print Mobile App Share:
Silicon wafers, precursors to chips.

The emerging field of advanced packaging is being hailed as an inflection point for the semiconductor industry.

Credit: Stephanie Davidson

The ongoing conflict between the U.S. and China over semiconductor chip production is expected to ramp up as the U.S. seeks to gain a competitive edge in the area of advanced packaging.

The semiconductor packaging process, which involves encasing chips in materials that protect them and permit their connection to electronic devices, has long been outsourced to Asia.

The Biden administration plans to create a $3-billion National Advanced Packaging Manufacturing Program to develop numerous high-volume packaging facilities by the end of the decade and ease the nation's reliance on Asian supply lines.

From Bloomberg
View Full Article - May Require Paid Subscription

 

Abstracts Copyright © 2023 SmithBucklin, Washington, D.C., USA


 

No entries found